IPD90P04P4L-04 optimos ? -p2 power-transistor features ? p-channel - logic level - enhancement mode ? aec qualified ? msl1 up to 260c peak reflow ? 175c operating temperature ? green package (rohs compliant) ? 100% avalanche tested maximum ratings, at t j =25 c, unless otherwise specified parameter symbol conditions unit continuous drain current 1) i d t c =25c, v gs =-10v -90 a t c =100c, v gs =-10v 2) -90 pulsed drain current 2) i d,pulse t c =25c -360 avalanche energy, single pulse 2) e as i d =-45a 60 mj avalanche current, single pulse i as - -90 a gate source voltage v gs - 16 3) v power dissipation p tot t c =25 c 125 w operating and storage temperature t j , t stg - -55 ... +175 c iec climatic category; din iec 68-1 - - 55/175/56 value v ds -40 v r ds(on) 4.3 m w i d -90 a product summary pg-to252-3-313 type package marking IPD90P04P4L-04 pg-to252-3-313 4p04l04 rev. 1.0 page 1 2011-04-27
IPD90P04P4L-04 parameter symbol conditions unit min. typ. max. thermal characteristics 2) thermal resistance, junction - case r thjc - - - 1.2 k/w smd version, device on pcb r thja minimal footprint - - 62 6 cm 2 cooling area 4) - - 40 electrical characteristics, at t j =25 c, unless otherwise specified static characteristics drain-source breakdown voltage v (br)dss v gs =0v, i d = -1ma -40 - - v gate threshold voltage v gs(th) v ds = v gs , i d =-250a -1.2 -1.7 -2.2 zero gate voltage drain current i dss v ds =-32v, v gs =0v, t j =25c - -0.08 -1 a v ds =-32v, v gs =0v, t j =125c 2) - -20 -200 gate-source leakage current i gss v gs =-16v, v ds =0v - - -100 na drain-source on-state resistance r ds(on) v gs =-4.5v, i d =-85a - 5.1 6.6 m w v gs =-10v, i d =-90a - 3.6 4.3 values rev. 1.0 page 2 2011-04-27
IPD90P04P4L-04 parameter symbol conditions unit min. typ. max. dynamic characteristics 2) input capacitance c iss - 8900 11570 pf output capacitance c oss - 2532 3800 reverse transfer capacitance c rss - 100 200 turn-on delay time t d(on) - 20 - ns rise time t r - 20 - turn-off delay time t d(off) - 140 - fall time t f - 60 - gate charge characteristics 2) gate to source charge q gs - 31 40 nc gate to drain charge q gd - 24 48 gate charge total q g - 135 176 gate plateau voltage v plateau - -3.5 - v reverse diode diode continous forward current 2) i s - - -90 a diode pulse current 2) i s,pulse - - -360 diode forward voltage v sd v gs =0v, i f =-90a, t j =25c - -1 -1.3 v reverse recovery time 2) t rr - 63 - ns reverse recovery charge 2) q rr - 72.3 - nc v r =-20v, i f =-50a, d i f /d t =-100a/s 2) defined by design. not subject to production test. 4) device on 40 mm x 40 mm x 1.5 mm epoxy pcb fr4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. pcb is vertical in still air. 3) v gs =+5v/-16v according aec; v gs =+16v for max 168h at t j =175c 1) current is limited by bondwire; with an r thjc = 1.2k/w the chip is able to carry -136a at 25c. t c =25c values v gs =0v, v ds =-25v, f =1mhz v dd =-20v, v gs =-10v, i d =-90a, r g =3.5 w v dd =-32v, i d =-90a, v gs =0 to -10v rev. 1.0 page 3 2011-04-27
IPD90P04P4L-04 1 power dissipation 2 drain current p tot = f( t c ); v gs - 6 v i d = f( t c ); v gs = -10v 3 safe operating area 4 max. transient thermal impedance i d = f( v ds ); t c = 25 c; d = 0 z thjc = f( t p ) parameter: t p parameter: d = t p / t 1 s 10 s 100 s 1 ms 1 10 100 1000 0.1 1 10 100 -v ds [v] - i d [ a ] single pulse 0.01 0.05 0.1 0.5 10 0 10 -1 10 -2 10 -3 10 -4 10 -5 10 -6 10 1 10 0 10 -1 10 -2 10 -3 t p [s] z t h j c [ k / w ] 0 20 40 60 80 100 120 140 0 50 100 150 200 t c [c] p t o t [ w ] 0 20 40 60 80 100 0 50 100 150 200 t c [c] - i d [ a ] rev. 1.0 page 4 2011-04-27
IPD90P04P4L-04 5 typ. output characteristics 6 typ. drain-source on-state resistance i d = f( v ds ); t j = 25 c r ds(on) = ( i d ); t j = 25 c parameter: - v gs parameter: - v gs 7 typ. transfer characteristics 8 typ. drain-source on-state resistance i d = f( v gs ); v ds = -6v r ds(on) = f( t j ); i d = -70 a; v gs = -10 v parameter: t j 2.5 3.5 4.5 5.5 -60 -20 20 60 100 140 180 t j [c] r d s ( o n ) [ m w ] -55 c 25 c 175 c 0 60 120 180 240 300 360 1.6 2.6 3.6 4.6 -v gs [v] - i d [ a ] 3v 3.5v 4v 4.5v 5v 10v 0 60 120 180 240 300 360 0 1 2 3 4 5 6 -v ds [v] - i d [ a ] 2.8v 3v 3.5v 4v 4.5v 5v 10v 3 8 13 18 23 0 30 60 90 -i d [a] r d s ( o n ) [ m w ] rev. 1.0 page 5 2011-04-27
IPD90P04P4L-04 9 typ. gate threshold voltage 10 typ. capacitances v gs(th) = f( t j ); v gs = v ds c = f( v ds ); v gs = 0 v; f = 1 mhz parameter: - i d 11 typical forward diode characteristicis 12 drain-source breakdown voltage if = f(v sd ) v br(dss) = f( t j ); i d = -1 ma parameter: t j 25 c 175 c 10 0 10 1 10 2 10 3 0 0.4 0.8 1.2 1.6 -v sd [v] - i f [ a ] ciss coss crss 10 5 10 4 10 3 10 2 10 1 0 5 10 15 20 25 30 -v ds [v] c [ p f ] 250a 2500a 0.5 1 1.5 2 -60 -20 20 60 100 140 180 t j [c] - v g s ( t h ) [ v ] 35 36 37 38 39 40 41 42 43 44 45 -60 -20 20 60 100 140 180 t j [c] - v b r ( d s s ) [ v ] rev. 1.0 page 6 2011-04-27
IPD90P04P4L-04 13 typ. gate charge 14 gate charge waveforms v gs = f( q gate ); i d = -90 a pulsed v gs = f( q gate ); i d = -90 a pulsed parameter: v dd parameter: v dd v gs q gate q gs q gd q g v gs q gate q gs q gd q g -8v -32v 0 1 2 3 4 5 6 7 8 9 10 0 35 70 105 140 q gate [nc] - v g s [ v ] rev. 1.0 page 7 2011-04-27
IPD90P04P4L-04 published by infineon technologies ag 81726 munich, germany ? infineon technologies ag 2011 all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. rev. 1.0 page 8 2011-04-27
IPD90P04P4L-04 revision history version 0.1 0.2 1.0 final data sheet date 29.01.2010 16.12.2010 27.04.2011 changes initial target data sheet preliminary data sheet rev. 1.0 page 9 2011-04-27
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